Being Proactive, for a Beautiful Completion
PUYA's product lineup on main applications
SPI NOR Flash
Ultra-low power consumption, wide voltage range, competitive die size, support for miniaturized packages (e.g. WLCSP, USON). Embedded systems, IoT devices, Bluetooth modules, AMOLED displays, optical modules, automotive memory
EEPROM (I²C / Serial EEPROM)
High endurance (e.g. up to 10 million erase cycles for some series), very long data retention (100+ years), ultra-low standby current, broad operating voltage & temperature ranges. Smart meters, camera modules, network devices, automotive parameter storage, industrial control
MCU (PY32 / 32-bit Arm Cortex M0+/M4 series)
Embedded 32-bit cores, low voltage operation, multiple interface peripherals (SPI, I2C, UART, ADC, timers). Wearables, IoT gateways, smart appliances, instrumentation, motor control
Analog / Mixed-Signal (Driver / VCM, etc.)
Analog front-end circuits, drivers (e.g. VCM driver for imaging) integrated with memory platforms. Imaging modules (camera), precision motion control, sensor interfaces
KGD / Known-Good Die Services
Bare die (chip-level) delivery, wafer-level options, for system-in-package (SiP) integration. OEMs and module integrators who embed memory or MCU die directly in advanced packaging
Ultra-Low Power & High Reliability in Non-Volatile Memory
"Puya emphasizes extremely low standby current, wide operating voltage windows, and robust data retention capabilities (often 100+ years) in its Flash and EEPROM products."
Multi-Domain Expansion via “Memory+” Strategy
"While its core is memory technology, Puya is actively expanding into MCU and analog IC realms. This allows it to provide more integrated and differentiated system-level solutions, rather than being confined solely to memory."
Flexible Packaging & Integration Options
"With support for standard packages (SOP, TSSOP, UDFN, SOT23, etc.) and advanced packages (WLCSP, bare die / KGD), Puya can serve both traditional module makers and customers needing ultra-compact integration."